![]() A broadband transition towards stripline, with a limited loss of 1.1 dB, is described to interface these waveguides with compactly integrated chips. The viability of the suggested technology platform is demonstrated by designing, fabricating and measuring several essential low-loss air-filled substrate-integrated-waveguide components, such as a dual rectangular filter, with a minimal insertion loss of 0.87 dB and 10 dB-matching within the (132.8–139.2 GHz) frequency band, and an air-filled waveguide with a routing loss of only 0.08 dB/mm and a flat amplitude variation within 0.01 dB/mm over the (115–155 GHz) frequency range. Specifically, the adapted stack accommodates broadband air-filled substrate-integrated-waveguide components for efficient long-range signal distribution and low-loss passives. A dedicated Any-Layer High Density Interconnect PCB technology for highly efficient wireless D-band (110–170 GHz) systems is proposed. ![]() To overcome the harsh propagation conditions, large-scale antenna arrays are crucial and urge the need for cost-effective, mass-manufacturable technologies. ![]() To accommodate the ever-growing data requirements in densely populated areas and address the need for high-resolution sensing in diverse next-generation applications, there is a noticeable trend towards utilizing large unallocated frequency bands above 100 GHz. ![]()
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